HSE-B254-045H
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Краткое описание:
Extruded Heat Sink, TO-220
Дополнительная информация
Extruded board-level heat sink cools TO-220 packages with vertical 4.5 mm solder pins for PCB mounting. The 25.4 mm long aluminum 6063-T5 body has a black anodized finish and measures 25.4 x 45 x 12.7 mm. Thermal resistance is 11.72 °C/W at 75 °C temperature rise under natural convection and 16.12 °C/W at 1 W under natural convection. Forced-air thermal resistance is 3.86 °C/W at 200 LFM and 2.52 °C/W at 400 LFM, with 6.4 W power dissipation at 75 °C temperature rise under natural convection.
| RoHS | Yes |
| REACH | Compliant |
| Finish | Black Anodized |
| Length | 25.4mm |
| Weight | 13.4g |
| Material | AL6063-T5 |
| Pin Plating | Tin |
| Pin Material | Steel |
| Military Spec | False |
| Mounting Hole | Not present |
| Mounting Style | PCB |
| Package Cooled | TO-220 |
| Dimensions LxWxH | 1 x 1.77 x 0.5in |
| Solder Pin Length | 4.5mm |
| Dimensional Tolerance | ±0.5mm |
| Thermal Resistance at 1 W, 200 LFM | 3.86°C/W |
| Thermal Resistance at 1 W, 400 LFM | 2.52°C/W |
| Thermal Resistance at 1 W, Natural Convection | 16.12°C/W |
| Power Dissipation at 75°C ΔT, Natural Convection | 6.4W |
| Thermal Resistance at 75°C ΔT, Natural Convection | 11.72°C/W |
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