IXYK110N120A4

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IXYK110N120A4 - Ixys
Краткое описание: Disc IGBT XPT Gen4 1200V 110A TO264
Производитель Ixys
Статус производства Производится (ACTIVE)

Дополнительная информация

Utilizing XPT™ thin-wafer technology and 4th generation (GenX4™) Trench IGBT process, these up to 1200V devices helps to reduced gate driver requirements and conduction losses. It features reduced thermal resistance, low losses, high current densities and low gate charge requirement. A positive collector-to-emitter voltage temperature coefficient enables designers to use multiple devices in parallel.
Weight 10g
Feature International Standard Package
Advantage Low Gate Drive Requirement
Application Inrush Current Protection Circuits
Package Type TO-264 (IXYK)
Package Standard International Standard Package
Pin Description C Collector
Pin Description E Emitter
Pin Description G Gate
Pin Description Tab Collector
Mounting Torque (M_d) 1.13/10Nm/lb.in
Terminal Current Limit (I_LRMS) 160A
Junction Temperature Range (T_J) -55 ... +175°C
Collector-Emitter Voltage (V_CES) 1200V
Storage Temperature Range (T_stg) -55 ... +175°C
Maximum Junction Temperature (T_JM) 175°C
Current Fall Time Typical (t_fi(typ)) 300ns
Collector Current (I_C110) @ T_C=110°C 110A
Gate-Emitter Voltage Max, Transient (V_GEM) ±30V
Gate-Emitter Voltage Max, Continuous (V_GES) ±20V
Reverse Bias Safe Operating Area (RBSOA) V_CE 0.8 V_CESV
Thermal Resistance, Case to Heatsink (R_thCS) 0.15 Typ°C/W
Thermal Resistance, Junction to Case (R_thJC) 0.11 Typ°C/W
Total Power Dissipation Max (P_C) @ T_C = 25°C 1360W
Collector-Emitter Saturation Voltage Max (V_CE(sat)) 1.80V
Transconductance (g_fs) @ I_C=60A, V_CE=10V (Note 1) 48 Min 80 TypS
Input Capacitance (C_ies) @ V_CE=25V, V_GE=0V, f=1MHz 6030 TyppF
Output Capacitance (C_oes) @ V_CE=25V, V_GE=0V, f=1MHz 340 TyppF
Pulsed Collector Current Max (I_CM) @ T_C = 25°C, 1ms 900A
Gate-Emitter Leakage Current (I_GES) @ V_GE=±20V, V_CE=0V ±200 MaxnA
Lead Soldering Temperature (T_L) @ 1.6mm from case for 10s 300°C
Collector Current Max (I_C25) @ T_C = 25°C (Chip Capability) 375A
Collector-Emitter Voltage Max (V_CES) @ T_J = 25°C to 175°C 1200V
Turn-on Energy (E_on) @ I_C=50A, V_GE=15V, T_J=25°C (Note 2) 2.5 TypmJ
Collector-Emitter Cutoff Current (I_CES) @ V_CE=V_CES, V_GE=0V 25 MaxμA
Gate-Emitter Threshold Voltage (V_GE(th)) @ I_C=3mA, V_CE=V_GE 4.5 Min 6.5 TypV
Turn-on Energy (E_on) @ I_C=50A, V_GE=15V, T_J=150°C (Note 2) 4.4 TypmJ
Turn-off Energy (E_off) @ I_C=50A, V_GE=15V, T_J=25°C (Note 2) 8.4 TypmJ
Current Fall Time (t_fi) @ I_C=50A, V_GE=15V, T_J=25°C (Note 2) 300 Typns
Current Rise Time (t_ri) @ I_C=50A, V_GE=15V, T_J=25°C (Note 2) 36 Typns
Reverse Transfer Capacitance (C_res) @ V_CE=25V, V_GE=0V, f=1MHz 225 TyppF
Turn-off Energy (E_off) @ I_C=50A, V_GE=15V, T_J=150°C (Note 2) 14.0 TypmJ
Current Fall Time (t_fi) @ I_C=50A, V_GE=15V, T_J=150°C (Note 2) 590 Typns
Current Rise Time (t_ri) @ I_C=50A, V_GE=15V, T_J=150°C (Note 2) 33 Typns
Gate-Emitter Charge (Q_ge) @ I_C=I_C110, V_GE=15V, V_CE=0.5*V_CES 58 TypnC
Collector-Emitter Breakdown Voltage (BV_CES) @ I_C=250µA, V_GE=0V 1200V
Total Gate Charge (Q_g(on)) @ I_C=I_C110, V_GE=15V, V_CE=0.5*V_CES 305 TypnC
Gate-Collector Charge (Q_gc) @ I_C=I_C110, V_GE=15V, V_CE=0.5*V_CES 148 TypnC
Turn-on Delay Time (t_d(on)) @ I_C=50A, V_GE=15V, T_J=25°C (Note 2) 42 Typns
Turn-on Delay Time (t_d(on)) @ I_C=50A, V_GE=15V, T_J=150°C (Note 2) 35 Typns
Turn-off Delay Time (t_d(off)) @ I_C=50A, V_GE=15V, T_J=25°C (Note 2) 550 Typns
Collector-Gate Voltage Max (V_CGR) @ T_J = 25°C to 175°C, R_GE = 1MΩ 1200V
Turn-off Delay Time (t_d(off)) @ I_C=50A, V_GE=15V, T_J=150°C (Note 2) 700 Typns
Collector-Emitter Cutoff Current (I_CES) @ V_CE=V_CES, V_GE=0V, T_J=125°C 500 MaxμA
Collector-Emitter Saturation Voltage (V_CE(sat)) @ I_C=I_C110, V_GE=15V, T_J=25°C (Note 1) 1.45 Typ 1.80 MaxV
Collector-Emitter Saturation Voltage (V_CE(sat)) @ I_C=I_C110, V_GE=15V, T_J=150°C (Note 1) 1.60 TypV
Reverse Bias Safe Operating Area (RBSOA) Pulsed Collector Current (I_CM) @ V_GE=15V, T_VJ=125C, R_G=2Ω 220A

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