KHX1600C10D3B1/8G
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Краткое описание:
DDR3 SDRAM 8GB 1600MHz 240-Pin DIMM CL10
Дополнительная информация
DDR3 SDRAM module offering 8GB total density with a 240-pin DIMM package. Features a 1600 MHz maximum clock rate, 64-bit data bus width, and dual ranks. This module utilizes 16 FBGA packaged chips, each with 4G bit density, organized as 1Gx64 with a 512Mx8 chip configuration. Operating supply voltage ranges from 1.425V to 1.575V, with a typical value of 1.5V. It supports a CAS latency of 10 and operates within a temperature range of 0°C to 85°C.
| PCB | 240 |
| ECCN | EAR99 |
| PPAP | No |
| HTS Code | 8473301140 |
| Mounting | Socket |
| Cage Code | 0P2J5 |
| Pin Count | 240 |
| Automotive | No |
| Lead Shape | No Lead |
| Schedule B | 8473300002 |
| CAS Latency | 10 |
| ECC Support | No |
| Module Type | 240DIMM |
| Subcategory | DDR3 SDRAM |
| Chip Density | 4Gbit |
| Organization | 1Gx64 |
| Package/Case | DIMM |
| AEC Qualified | No |
| Main Category | DRAM Module |
| RoHS Versions | 2002/95/EC |
| Total Density | 8Gbyte |
| Data Bus Width | 64bit |
| Pin Pitch (mm) | 1 |
| Number of Ranks | Dual |
| Chip Package Type | FBGA |
| Basic Package Type | Non-Lead-Frame SMT |
| Chip Configuration | 512Mx8 |
| Maximum Clock Rate | 1600MHz |
| Package Description | Dual In Line Memory Module |
| Package Family Name | DIM |
| Package Height (mm) | 30 |
| Package Length (mm) | 133.35 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | 0°C |
| Number of Chip per Module | 16 |
| Max Operating Supply Voltage | 1.575V |
| Min Operating Supply Voltage | 1.425V |
| Typical Operating Supply Voltage | 1.5V |
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