KHX26C11T2K2/8X
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Краткое описание:
DDR3 8GB 240-Pin DIMM 2666MHz CL11
Дополнительная информация
DDR3 SDRAM module, 8GB total density, 240-pin DIMM form factor. Features a 2666 MHz maximum clock rate, 64-bit data bus width, and CAS Latency of 11. Organized as 512Mx64x2 with 32 chips per module, each with 2G bit chip density and FBGA package type. Operates at a typical 1.5V supply voltage with a 0°C to 85°C temperature range.
| PCB | 240 |
| ECCN | EAR99 |
| PPAP | No |
| HTS Code | 8473301140 |
| Mounting | Socket |
| Cage Code | 0P2J5 |
| Pin Count | 240 |
| Automotive | No |
| Lead Shape | No Lead |
| Schedule B | 8473300002 |
| CAS Latency | 11 |
| ECC Support | No |
| Module Type | 240DIMM |
| Subcategory | DDR3 SDRAM |
| Chip Density | 2Gbit |
| Organization | 512Mx64x2 |
| Package/Case | DIMM |
| AEC Qualified | No |
| Main Category | DRAM Module |
| RoHS Versions | 2002/95/EC |
| Total Density | 8Gbyte |
| Data Bus Width | 64bit |
| Pin Pitch (mm) | 1 |
| Number of Ranks | Dual |
| Chip Package Type | FBGA |
| Basic Package Type | Non-Lead-Frame SMT |
| Chip Configuration | 256Mx8 |
| Maximum Clock Rate | 2666MHz |
| Package Width (mm) | 7.24 |
| Package Description | Dual In Line Memory Module |
| Package Family Name | DIM |
| Package Height (mm) | 53.9 |
| Package Length (mm) | 133.35 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | 0°C |
| Number of Chip per Module | 32 |
| Max Operating Supply Voltage | 1.575V |
| Min Operating Supply Voltage | 1.425V |
| Typical Operating Supply Voltage | 1.5V |
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