LM3S3N26-EBZ20-C0T
Снят с производства
Краткое описание:
32-bit ARM Cortex M3 MCU, 20MHz, 64KB Flash, 108-Pin NFBGA
Дополнительная информация
32-bit ARM Cortex M3 RISC microcontroller featuring 64KB Flash program memory and 12KB RAM. This surface-mount device operates at a maximum clock rate of 20 MHz and supports a 1.2V/3.3V supply voltage range. It offers 33 programmable I/Os, three timers, and interfaces including I2C, SSI, UART, and USB. The 108-pin NFBGA package measures 10mm x 10mm x 1.02mm with a 0.8mm pin pitch.
| CAN | 0 |
| I2C | 2 |
| I2S | 0 |
| PCB | 108 |
| SPI | 0 |
| USB | 1 |
| PPAP | No |
| UART | 3 |
| Jedec | MO-219 |
| USART | 0 |
| Ethernet | 0 |
| HTS Code | 8542310001 |
| Mounting | Surface Mount |
| RAM Size | 12KB |
| Cage Code | 01295 |
| Pin Count | 108 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542310000 |
| Device Core | ARM Cortex M3 |
| Family Name | Stellaris |
| ADC Channels | 8 |
| Package/Case | NFBGA |
| AEC Qualified | No |
| RoHS Versions | 2002/95/EC |
| Data Bus Width | 32bit |
| Interface Type | I2C/SSI/UART/USB |
| Number of ADCs | Single |
| Pin Pitch (mm) | 0.8 |
| Programmability | Yes |
| Number of Timers | 3 |
| Package Material | Plastic |
| Core Architecture | ARM |
| Basic Package Type | Ball Grid Array |
| Maximum Clock Rate | 20MHz |
| Package Width (mm) | 10 |
| Package Description | Plastic Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 1.02 |
| Package Length (mm) | 10 |
| Program Memory Size | 64KB |
| Program Memory Type | Flash |
| Radiation Hardening | No |
| Maximum CPU Frequency | 20MHz |
| Seated Plane Height (mm) | 1.36 |
| Max Operating Temperature | 105°C |
| Min Operating Temperature | -40°C |
| Number of Programmable I/Os | 33 |
| Instruction Set Architecture | RISC |
| Max Operating Supply Voltage | 1.32|3.6V |
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