LM3S9997-EBZ50-C0
Дополнительная информация
| PCB | 108 |
| PPAP | No |
| Jedec | MO-219 |
| HTS Code | 8542310001 |
| Mounting | Surface Mount |
| RAM Size | 64KB |
| Cage Code | 01295 |
| Pin Count | 108 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542310000 |
| Device Core | ARM Cortex M3 |
| Family Name | Stellaris |
| ADC Channels | 16/16 |
| Package/Case | NFBGA |
| AEC Qualified | No |
| RoHS Versions | 2011/65/EU |
| Data Bus Width | 32bit |
| Interface Type | I2C/SPI/SSI/UART |
| Number of ADCs | Dual |
| Pin Pitch (mm) | 0.8 |
| Programmability | Yes |
| Number of Timers | 4 |
| Package Material | Plastic |
| Core Architecture | ARM |
| Basic Package Type | Ball Grid Array |
| Maximum Clock Rate | 50MHz |
| Package Width (mm) | 10 |
| Package Description | Plastic Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 1.02 |
| Package Length (mm) | 10 |
| Program Memory Size | 256KB |
| Program Memory Type | Flash |
| Radiation Hardening | No |
| Maximum CPU Frequency | 50MHz |
| Seated Plane Height (mm) | 1.36 |
| Max Operating Temperature | 105°C |
| Min Operating Temperature | -40°C |
| Number of Programmable I/Os | 60 |
| Instruction Set Architecture | RISC |
| Max Operating Supply Voltage | 1.32|3.6V |
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