LPC2106FHN48/01
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Краткое описание:
ARM7TDMI-S MCU, 16/32-bit RISC, 60MHz, 128KB Flash, 48-Pin HVQFN EP
Дополнительная информация
16/32-bit ARM7TDMI-S RISC microcontroller featuring a 60 MHz maximum clock rate and 128KB Flash program memory. This MCU offers 64KB RAM, 32 programmable I/Os, and multiple interfaces including I2C and UART. Packaged in a 48-pin HVQFN EP (7.1x7.1x0.95mm) with a 0.5mm pin pitch, it supports surface mounting and operates from 1.8V to 3.3V with a temperature range of -40°C to 85°C.
| CAN | 0 |
| I2C | 1 |
| I2S | 0 |
| PCB | 48 |
| SPI | 0 |
| USB | 0 |
| ECCN | EAR99 |
| PPAP | No |
| UART | 2 |
| Jedec | MO-243VKKD |
| USART | 0 |
| EU RoHS | Yes |
| Ethernet | 0 |
| HTS Code | 8542310001 |
| Mounting | Surface Mount |
| RAM Size | 64KB |
| Cage Code | H1R01 |
| Pin Count | 48 |
| Automotive | No |
| Lead Shape | No Lead |
| Schedule B | 8542310000 |
| Device Core | ARM7TDMI-S |
| Family Name | LPC2000 |
| Package/Case | HVQFN EP |
| AEC Qualified | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Data Bus Width | 16|32bit |
| Interface Type | I2C/UART |
| Pin Pitch (mm) | 0.5 |
| Programmability | Yes |
| Number of Timers | 2 |
| Package Material | Plastic |
| Core Architecture | ARM |
| Basic Package Type | Non-Lead-Frame SMT |
| Maximum Clock Rate | 60MHz |
| Package Width (mm) | 7.1(Max) |
| Package Description | Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad |
| Package Family Name | QFN |
| Package Height (mm) | 0.95(Max) |
| Package Length (mm) | 7.1(Max) |
| Program Memory Size | 128KB |
| Program Memory Type | Flash |
| Radiation Hardening | No |
| Maximum CPU Frequency | 60MHz |
| Seated Plane Height (mm) | 1(Max) |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Number of Programmable I/Os | 32 |
| Instruction Set Architecture | RISC |
| Max Operating Supply Voltage | 1.95|3.6V |
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