LPC2292FET144/01
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Краткое описание:
16/32-bit ARM7 MCU, 256KB Flash, 144-Pin TFBGA
Дополнительная информация
16-bit/32-bit ARM7TDMI-S RISC microcontroller featuring a 60 MHz clock rate and 256KB Flash program memory. This surface-mount device offers 16KB RAM, 112 programmable I/Os, and 8 ADC channels. Integrated interfaces include 2 CAN, 1 I2C, 2 SPI, and 2 UART. Housed in a 144-pin TFBGA package with dimensions of 12x12x0.8mm, it operates from 1.8V to 3.3V and across an industrial temperature range of -40°C to 85°C.
| CAN | 2 |
| I2C | 1 |
| I2S | 0 |
| PCB | 144 |
| SPI | 2 |
| USB | 0 |
| ECCN | EAR99 |
| PPAP | No |
| UART | 2 |
| Jedec | MO-216 |
| USART | 0 |
| EU RoHS | Yes |
| Ethernet | 0 |
| HTS Code | 8542310001 |
| Mounting | Surface Mount |
| RAM Size | 16KB |
| Cage Code | H1R01 |
| Pin Count | 144 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542310000 |
| Device Core | ARM7TDMI-S |
| Family Name | LPC2000 |
| ADC Channels | 8 |
| Package/Case | TFBGA |
| AEC Qualified | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Data Bus Width | 16|32bit |
| Interface Type | CAN/I2C/SPI/SSP/UART |
| Number of ADCs | Single |
| Programmability | Yes |
| Number of Timers | 2 |
| Package Material | Plastic |
| Core Architecture | ARM |
| Basic Package Type | Ball Grid Array |
| Maximum Clock Rate | 60MHz |
| Package Width (mm) | 12 |
| Package Description | Thin Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 0.8 |
| Package Length (mm) | 12 |
| Program Memory Size | 256KB |
| Program Memory Type | Flash |
| Radiation Hardening | No |
| Maximum CPU Frequency | 60MHz |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Number of Programmable I/Os | 112 |
| Instruction Set Architecture | RISC |
| Max Operating Supply Voltage | 1.95|3.6V |
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