M470L2923DV0-CB300
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Краткое описание:
DRAM Module 1GB DDR2 200USODIMM 64-bit 333MHz
Дополнительная информация
1Gbyte DDR SDRAM 200USODIMM module, featuring 16 x 512M bit chips organized as 128Mx64. This unbuffered small outline dual in line memory module operates at a maximum clock rate of 333 MHz with a 64-bit data bus width and dual ranks. The 200-pin USODIMM package, with a 0.6mm pin pitch, is designed for socket mounting and has a package length of 67.6mm and a maximum width of 3.8mm. It supports a typical operating supply voltage of 2.5V, with a CAS latency of 2.5, and operates within a temperature range of 0°C to 70°C.
| PCB | 200 |
| ECCN | EAR99 |
| PPAP | No |
| EU RoHS | Yes |
| HTS Code | 8473301140 |
| Mounting | Socket |
| Cage Code | 1542F |
| Pin Count | 200 |
| Automotive | No |
| Lead Shape | No Lead |
| Schedule B | 8473300002 |
| CAS Latency | 2.5 |
| ECC Support | No |
| Module Type | 200USODIMM |
| Subcategory | DDR SDRAM |
| Chip Density | 512Mbit |
| Organization | 128Mx64 |
| Package/Case | USODIMM |
| AEC Qualified | No |
| Main Category | DRAM Module |
| RoHS Versions | 2002/95/EC |
| Total Density | 1Gbyte |
| Data Bus Width | 64bit |
| Pin Pitch (mm) | 0.6 |
| Number of Ranks | Dual |
| Chip Package Type | 66TSOP-II |
| Basic Package Type | Non-Lead-Frame SMT |
| Chip Configuration | 64Mx8 |
| Maximum Clock Rate | 333MHz |
| Package Width (mm) | 3.8(Max) |
| Maximum Access Time | 0.7ns |
| Package Description | Unbuffered Small Outline Dual In Line Memory Module |
| Package Family Name | DIM |
| Package Height (mm) | 31.75 |
| Package Length (mm) | 67.6 |
| Max Operating Temperature | 70°C |
| Maximum Operating Current | 1560mA |
| Min Operating Temperature | 0°C |
| Number of Chip per Module | 16 |
| Max Operating Supply Voltage | 2.7V |
| Min Operating Supply Voltage | 2.3V |
| Typical Operating Supply Voltage | 2.5V |
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