M58LW032D110ZA1F
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Краткое описание:
32Mb NOR Flash, Parallel, 3V/3.3V, 110ns, 64-Pin TBGA
Дополнительная информация
32M-bit NOR Flash memory with a parallel interface, offering 4M x 8 or 2M x 16 word configurations. Features a 110ns maximum access time and operates from 2.7V to 3.6V programming voltage, with typical supply voltages of 3V or 3.3V. This surface-mount component is housed in a 64-pin Thin Profile Ball Grid Array (TBGA) package, measuring 13mm x 10mm x 0.85mm, with a 1mm pin pitch. It supports an address bus width of 22/21 bits and a data bus width of 8/16 bits per word, operating within a temperature range of 0°C to 70°C.
| PCB | 64 |
| ECCN | 3A991.b.1.a |
| PPAP | No |
| Density | 32Mbit |
| HTS Code | 8542320071 |
| Mounting | Surface Mount |
| Cage Code | 6Y440 |
| Pin Count | 64 |
| Automotive | No |
| Boot Block | No |
| Lead Shape | Ball |
| Schedule B | 8542320070 |
| Timing Type | Asynchronous |
| Architecture | Sectored |
| Package/Case | TBGA |
| AEC Qualified | No |
| Interface Type | Parallel |
| Pin Pitch (mm) | 1 |
| Number of Words | 4M/2M |
| Package Material | Plastic |
| Address Bus Width | 22/21bit |
| Basic Package Type | Ball Grid Array |
| Block Organization | Symmetrical |
| Package Width (mm) | 10 |
| Maximum Access Time | 110ns |
| Package Description | Thin Profile Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 0.85(Max) |
| Package Length (mm) | 13 |
| Programming Voltage | 2.7 to 3.6V |
| Radiation Hardening | No |
| Number of Bits per Word | 8/16bit |
| Seated Plane Height (mm) | 0.85(Max) |
| Max Operating Temperature | 70°C |
| Maximum Operating Current | 20mA |
| Min Operating Temperature | 0°C |
| Typical Operating Supply Voltage | 3|3.3V |
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