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Краткое описание:
RF Amplifier, 1000MHz, 23dB Gain, 4-Element, 16-Pin TSSOP EP
Дополнительная информация
Quad-element push-pull RF amplifier operating up to 1000 MHz, delivering 23 dB maximum power gain with 0.6 dB typical gain flatness. Features a 16-pin Thin Shrink Small Outline Package (TSSOP EP) with exposed pad, measuring 5mm x 4.4mm x 1mm, utilizing gull-wing lead-frame SMT mounting. Designed for surface mount applications with a 0.65mm pin pitch, this plastic package operates within a temperature range of -40°C to 85°C. Exhibits typical performance of -70dBc for CTB, Xmod, and CSO at specified test conditions.
| PCB | 16 |
| PPAP | No |
| Jedec | MO-153AB |
| EU RoHS | Yes |
| HTS Code | 8542330001 |
| Mounting | Surface Mount |
| Cage Code | 55NN2 |
| Pin Count | 16 |
| Automotive | No |
| Lead Shape | Gull-wing |
| Schedule B | 8542330000 |
| Package/Case | TSSOP EP |
| AEC Qualified | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Basic Package Type | Lead-Frame SMT |
| Package Width (mm) | 4.4 |
| Package Description | Thin Shrink Small Outline Package, Exposed Pad |
| Package Family Name | SOP |
| Package Height (mm) | 1 |
| Package Length (mm) | 5 |
| Seated Plane Height (mm) | 1.2(Max) |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Maximum Operating Frequency | 1000MHz |
| Number of Elements per Chip | 4 |
| Maximum CSO @ Test Conditions | -70dBc(Typ) |
| Maximum CTB @ Test Conditions | -70dBc(Typ) |
| Maximum Xmod @ Test Conditions | -70dBc(Typ) |
| Maximum Power Gain @ Maximum Frequency | 23dB |
| Maximum Gain Flatness @ Maximum Frequency | 0.6(Typ)dB |
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