MAX3100EEE-TG068
Дополнительная информация
| PCB | 16 |
| ECCN | EAR99 |
| PPAP | No |
| Jedec | MO-137AB |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| Cage Code | 1ES66 |
| Pin Count | 16 |
| Automotive | No |
| Lead Shape | Gull-wing |
| Schedule B | 8542390000 |
| Package/Case | QSOP |
| Receive FIFO | 16byte |
| AEC Qualified | No |
| Transmit FIFO | 16byte |
| Pin Pitch (mm) | 0.64 |
| Package Material | Plastic |
| Maximum Data Rate | 230KBd |
| Basic Package Type | Lead-Frame SMT |
| Package Width (mm) | 3.89 |
| Standard Supported | RS-232|RS-485 |
| Package Description | Quarter Size Outline Package Or Quality Small Outline Package |
| Package Family Name | SOP |
| Package Height (mm) | 1.47 |
| Package Length (mm) | 4.9 |
| Radiation Hardening | No |
| Maximum Supply Current | 1mA |
| Seated Plane Height (mm) | 1.6 |
| Max Operating Temperature | 85°C |
| Maximum Power Dissipation | 667mW |
| Min Operating Temperature | -40°C |
| Number of Channels per Chip | 1 |
| Max Operating Supply Voltage | 5.5V |
| Min Operating Supply Voltage | 2.7V |
| Typical Operating Supply Voltage | 3.3|5V |
| Transmitter and Receiver FIFO Counter | No |
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