MBM29DL322TD-80PBT-E1
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Краткое описание:
32M-bit NOR Flash, 80ns, 3.3V, 57-Pin FBGA, Parallel
Дополнительная информация
32M-bit NOR Flash memory with a parallel interface, featuring 4M x 8 or 2M x 16 word organization and an 80ns maximum access time. This surface-mount component utilizes a 57-pin Fine Pitch Ball Grid Array (FBGA) package with a 0.8mm pin pitch. It operates from a 3.3V supply, with programming voltages ranging from 2.7 to 3.6V and 8.5 to 9.5V. The memory architecture is sectored with an asymmetrical block organization and includes a top boot block. Operating temperature range is -20°C to 70°C.
| PCB | 57 |
| ECCN | 3A991.b.1.a |
| PPAP | No |
| Density | 32Mbit |
| EU RoHS | Yes |
| HTS Code | 8542320071 |
| Mounting | Surface Mount |
| Cage Code | 65786 |
| Pin Count | 57 |
| Automotive | No |
| Boot Block | Yes |
| Lead Shape | Ball |
| Schedule B | 8542320070 |
| Timing Type | Asynchronous |
| Architecture | Sectored |
| Package/Case | FBGA |
| AEC Qualified | No |
| RoHS Versions | 2002/95/EC |
| Interface Type | Parallel |
| Pin Pitch (mm) | 0.8 |
| Number of Words | 4M/2M |
| Package Material | Plastic |
| Address Bus Width | 22/21bit |
| Basic Package Type | Ball Grid Array |
| Block Organization | Asymmetrical |
| Package Width (mm) | 7.95 |
| Maximum Access Time | 80ns |
| Package Description | Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 0.69 |
| Package Length (mm) | 13.95 |
| Programming Voltage | 2.7 to 3.6|8.5 to 9.5V |
| Radiation Hardening | No |
| Location of Boot Block | Top |
| Number of Bits per Word | 8/16bit |
| Seated Plane Height (mm) | 1.05 |
| Max Operating Temperature | 70°C |
| Maximum Operating Current | 18mA |
| Min Operating Temperature | -20°C |
| Typical Operating Supply Voltage | 3.3V |
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