MC74HCT125ADTG
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Краткое описание:
4-CH 3-ST Non-Inv Buffer/Line Driver, HCT CMOS, 14-Pin TSSOP
Дополнительная информация
Automotive-grade CMOS buffer/line driver featuring four non-inverting, 3-state elements. This integrated circuit utilizes HCT logic family technology and is housed in a 14-pin TSSOP W surface-mount package with gull-wing leads. The package dimensions are a maximum of 5.1mm length, 4.5mm width, and 1.05mm height, with a 0.65mm pin pitch. Operating across a temperature range of -55°C to 125°C, it is designed for lead-frame SMT mounting.
| PCB | 14 |
| ECCN | EAR99 |
| PPAP | No |
| Jedec | MO-153AB-1 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| Polarity | Non-Inverting |
| Cage Code | 5V1P1 |
| Pin Count | 14 |
| Automotive | Yes |
| Lead Shape | Gull-wing |
| Schedule B | 8542390000 |
| Output Type | 3-State |
| Logic Family | HCT |
| Package/Case | TSSOP W |
| AEC Qualified | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Logic Function | Buffer/Line Driver |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Basic Package Type | Lead-Frame SMT |
| Package Width (mm) | 4.5(Max) |
| Process Technology | CMOS |
| Package Description | Thin Shrink Small Outline Package |
| Package Family Name | SOP |
| Package Height (mm) | 1.05(Max) |
| Package Length (mm) | 5.1(Max) |
| Radiation Hardening | No |
| Seated Plane Height (mm) | 1.2(Max) |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -55°C |
| Number of Inputs per Chip | 4 |
| Number of Outputs per Chip | 4 |
| Number of Elements per Chip | 4 |
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