MC9S12XEP100CVL
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Краткое описание:
16-bit RISC MCU, 1MB Flash, 208-Pin MAP-BGA, 50MHz, Automotive
Дополнительная информация
16-bit RISC microcontroller featuring 1MB Flash program memory and 64KB RAM. This HCS12X family MCU operates at up to 50 MHz, offering 152 programmable I/Os and dual ADCs with 32 channels each. It supports CAN (5), I2C (2), and SPI (3) interfaces, with a maximum operating supply voltage range of 1.98V to 5.5V. Packaged in a 208-pin MAP-BGA with a 17mm x 17mm footprint, this surface-mount component is designed for automotive applications and operates from -40°C to 85°C.
| CAN | 5 |
| I2C | 2 |
| I2S | 0 |
| PCB | 208 |
| SPI | 3 |
| USB | 0 |
| ECCN | 3A991.a.2 |
| UART | 0 |
| USART | 0 |
| EU RoHS | Yes |
| Ethernet | 0 |
| HTS Code | 8542310001 |
| Mounting | Surface Mount |
| RAM Size | 64KB |
| Cage Code | H1R01 |
| Pin Count | 208 |
| Automotive | Yes |
| Lead Shape | Ball |
| Schedule B | 8542310000 |
| Device Core | HCS12X |
| Family Name | HCS12X |
| ADC Channels | 32/32 |
| Package/Case | MAP-BGA |
| AEC Qualified | Yes |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Data Bus Width | 16bit |
| Interface Type | CAN/I2C/SCI/SPI |
| Number of ADCs | Dual |
| Pin Pitch (mm) | 1 |
| Programmability | Yes |
| Number of Timers | 1 |
| Package Material | Plastic |
| Core Architecture | HCS12X |
| Basic Package Type | Ball Grid Array |
| Maximum Clock Rate | 50MHz |
| Package Width (mm) | 17 |
| Package Description | Molded Array Process Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 1.3(Max) |
| Package Length (mm) | 17 |
| Program Memory Size | 1MB |
| Program Memory Type | Flash |
| Radiation Hardening | No |
| Maximum CPU Frequency | 50MHz |
| Seated Plane Height (mm) | 2(Max) |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Number of Programmable I/Os | 152 |
| Instruction Set Architecture | RISC |
| Max Operating Supply Voltage | 1.98|2.9|5.5V |
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