MSP430F2330IYFFR
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Краткое описание:
16-bit RISC MCU, 8KB Flash, 49-Pin DSBGA, 16MHz
Дополнительная информация
16-bit RISC microcontroller featuring 8KB Flash program memory and 1KB RAM. This surface-mount device utilizes a Die Size Ball Grid Array (DSBGA) package with a 0.4mm pin pitch, measuring 3.1mm x 3.1mm x 0.43mm. Operates at up to 16 MHz with 32 programmable I/Os, supporting I2C, SCI, SPI, and UART interfaces. Includes two timers and a single DAC, with an operating voltage range of 2.5V to 3.6V and an extended temperature range of -40°C to 85°C.
| CAN | 0 |
| I2C | 1 |
| I2S | 0 |
| PCB | 49 |
| SPI | 2 |
| USB | 0 |
| ECCN | EAR99 |
| PPAP | No |
| UART | 1 |
| USART | 0 |
| EU RoHS | Yes |
| Ethernet | 0 |
| HTS Code | 8542310001 |
| Mounting | Surface Mount |
| RAM Size | 1KB |
| Cage Code | 01295 |
| Pin Count | 49 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542310000 |
| Device Core | MSP430 |
| Family Name | MSP430 |
| Package/Case | DSBGA |
| AEC Qualified | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Data Bus Width | 16bit |
| Interface Type | I2C/SCI/SPI/UART |
| Number of DACs | Single |
| Pin Pitch (mm) | 0.4 |
| Programmability | Yes |
| Number of Timers | 2 |
| Package Material | Plastic |
| Core Architecture | MSP430 |
| Basic Package Type | Ball Grid Array |
| Maximum Clock Rate | 16MHz |
| Package Width (mm) | 3.1 |
| Package Description | Die Size Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 0.43 |
| Package Length (mm) | 3.1 |
| Program Memory Size | 8KB |
| Program Memory Type | Flash |
| Radiation Hardening | No |
| Maximum CPU Frequency | 16MHz |
| Seated Plane Height (mm) | 0.63(Max) |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Number of Programmable I/Os | 32 |
| Instruction Set Architecture | RISC |
| Max Operating Supply Voltage | 3.6V |
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