MT8VDDT3264HG-26AF3
Увеличить
Краткое описание:
DDR2 SDRAM 256MB 200SODIMM 266MHz 64-bit
Дополнительная информация
256Mbyte DDR SDRAM module, 200-pin SODIMM form factor, operating at 266 MHz with a 64-bit data bus width. Features 8 x 256M bit chips, organized as 32Mx64 (32Mx8 chip configuration), and a CAS Latency of 2. This module utilizes a non-lead-frame SMT package (DIM family, JEDEC MO-224) with a 0.61mm pin pitch, designed for socket mounting and measuring 67.75mm (Max) length, 3.8mm (Max) width, and 31.9mm (Max) height. Operates with a typical supply voltage of 2.5V (2.3V-2.7V range) and supports temperatures from 0°C to 70°C.
| PCB | 200 |
| ECCN | EAR99 |
| PPAP | No |
| Jedec | MO-224 |
| EU RoHS | No |
| HTS Code | 8473301140 |
| Mounting | Socket |
| Cage Code | 6Y440 |
| Pin Count | 200 |
| Automotive | No |
| Lead Shape | No Lead |
| Schedule B | 8473300002 |
| CAS Latency | 2 |
| ECC Support | No |
| Module Type | 200SODIMM |
| Subcategory | DDR SDRAM |
| Chip Density | 256Mbit |
| Organization | 32Mx64 |
| Package/Case | SODIMM |
| AEC Qualified | No |
| Main Category | DRAM Module |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Total Density | 256Mbyte |
| Data Bus Width | 64bit |
| Pin Pitch (mm) | 0.61 |
| Number of Ranks | Single |
| Basic Package Type | Non-Lead-Frame SMT |
| Chip Configuration | 32Mx8 |
| Maximum Clock Rate | 266MHz |
| Package Width (mm) | 3.8(Max) |
| Package Description | Small Outline Dual In Line Memory Module |
| Package Family Name | DIM |
| Package Height (mm) | 31.9(Max) |
| Package Length (mm) | 67.75(Max) |
| Max Operating Temperature | 70°C |
| Maximum Operating Current | 1200mA |
| Min Operating Temperature | 0°C |
| Number of Chip per Module | 8 |
| Max Operating Supply Voltage | 2.7V |
| Min Operating Supply Voltage | 2.3V |
| Typical Operating Supply Voltage | 2.5V |
Если у вас не открывается документ, нажмите, чтобы открыть файл в новой вкладке.
