NAND01GR3A2CZB6E
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Краткое описание:
1G-bit SLC NAND Flash, Parallel, 1.8V, 63-Pin TFBGA
Дополнительная информация
1G-bit SLC NAND Flash memory with a parallel interface, featuring a 128M x 8 organization. This surface-mount component utilizes a 63-pin TFBGA package with a 0.8mm pitch, measuring 11mm x 9mm x 0.8mm. Operating at 1.8V, it offers a maximum access time of 15µs and a maximum operating current of 15mA. The memory is designed with a symmetrical, sectored architecture and operates within a temperature range of -40°C to 85°C.
| PCB | 63 |
| ECCN | 3A991.b.1.a |
| PPAP | No |
| Density | 1Gbit |
| EU RoHS | Yes |
| HTS Code | 8542320071 |
| Mounting | Surface Mount |
| Cage Code | 6Y440 |
| Pin Count | 63 |
| Automotive | No |
| Boot Block | No |
| Lead Shape | Ball |
| Schedule B | 8542320070 |
| Timing Type | Asynchronous |
| Architecture | Sectored |
| Package/Case | TFBGA |
| AEC Qualified | No |
| RoHS Versions | 2002/95/EC |
| Interface Type | Parallel |
| Pin Pitch (mm) | 0.8 |
| Number of Words | 128M |
| Package Material | Plastic |
| Address Bus Width | 27bit |
| Basic Package Type | Ball Grid Array |
| Block Organization | Symmetrical |
| Package Width (mm) | 9 |
| Maximum Access Time | 15000ns |
| Package Description | Thin Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 0.8 |
| Package Length (mm) | 11 |
| Radiation Hardening | No |
| Number of Bits per Word | 8bit |
| Seated Plane Height (mm) | 0.8 |
| Max Operating Temperature | 85°C |
| Maximum Operating Current | 15mA |
| Min Operating Temperature | -40°C |
| Typical Operating Supply Voltage | 1.8V |
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