NAND128R3A0CZA6E
Увеличить
Краткое описание:
128M-bit SLC NAND Flash, 1.8V, 55-Pin VFBGA, Parallel
Дополнительная информация
128M-bit SLC NAND Flash memory, featuring a parallel interface and 1.8V operating voltage. This VFBGA package offers 55 pins with a 0.8mm pitch, measuring 10mm x 8mm x 0.7mm. Designed for surface mounting, it provides 16M words x 8 bits per word with a maximum access time of 12µs. Operating across a -40°C to 85°C temperature range, this component utilizes a symmetrical, sectored block organization.
| PCB | 55 |
| ECCN | 3A991.b.1.a |
| PPAP | No |
| Density | 128Mbit |
| EU RoHS | Yes |
| HTS Code | 8542320071 |
| Mounting | Surface Mount |
| Cage Code | 6Y440 |
| Pin Count | 55 |
| Automotive | No |
| Boot Block | No |
| Lead Shape | Ball |
| Schedule B | 8542320070 |
| Timing Type | Asynchronous |
| Architecture | Sectored |
| Package/Case | VFBGA |
| AEC Qualified | No |
| RoHS Versions | 2002/95/EC |
| Interface Type | Parallel |
| Pin Pitch (mm) | 0.8 |
| Number of Words | 16M |
| Package Material | Plastic |
| Address Bus Width | 27bit |
| Basic Package Type | Ball Grid Array |
| Block Organization | Symmetrical |
| Package Width (mm) | 8 |
| Maximum Access Time | 12000ns |
| Package Description | Very Thin Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 0.7(Max) |
| Package Length (mm) | 10 |
| Radiation Hardening | No |
| Number of Bits per Word | 8bit |
| Seated Plane Height (mm) | 0.7(Max) |
| Max Operating Temperature | 85°C |
| Maximum Operating Current | 15mA |
| Min Operating Temperature | -40°C |
| Typical Operating Supply Voltage | 1.8V |
Если у вас не открывается документ, нажмите, чтобы открыть файл в новой вкладке.
