NAND512W3A2BZB1F
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Краткое описание:
512Mb SLC NAND Flash, Parallel, 3V/3.3V, 55-Pin TFBGA
Дополнительная информация
512M-bit SLC NAND Flash memory, featuring a parallel interface and 64M x 8 word organization. This surface-mount component utilizes a 55-pin Thin Fine Pitch Ball Grid Array (TFBGA) package with a 0.8mm pin pitch, measuring 10mm x 8mm x 0.8mm. Operates at 3V or 3.3V with a maximum operating current of 20mA and an asynchronous timing type. Offers a maximum access time of 12,000 ns and a 27-bit address bus. Suitable for operation within a 0°C to 70°C temperature range.
| PCB | 55 |
| ECCN | 3A991.b.1.a |
| PPAP | No |
| Density | 512Mbit |
| EU RoHS | Yes |
| HTS Code | 8542320071 |
| Mounting | Surface Mount |
| Cage Code | 6Y440 |
| Pin Count | 55 |
| Automotive | No |
| Boot Block | No |
| Lead Shape | Ball |
| Schedule B | 8542320070 |
| Timing Type | Asynchronous |
| Architecture | Sectored |
| Package/Case | TFBGA |
| AEC Qualified | No |
| RoHS Versions | 2002/95/EC |
| Interface Type | Parallel |
| Pin Pitch (mm) | 0.8 |
| Number of Words | 64M |
| Package Material | Plastic |
| Address Bus Width | 27bit |
| Basic Package Type | Ball Grid Array |
| Block Organization | Symmetrical |
| Package Width (mm) | 8 |
| Maximum Access Time | 12000ns |
| Package Description | Thin Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 0.8 |
| Package Length (mm) | 10 |
| Radiation Hardening | No |
| Number of Bits per Word | 8bit |
| Seated Plane Height (mm) | 0.8 |
| Max Operating Temperature | 70°C |
| Maximum Operating Current | 20mA |
| Min Operating Temperature | 0°C |
| Typical Operating Supply Voltage | 3|3.3V |
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