NSSW100DT
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Краткое описание:
Optoelectronic Device,
Дополнительная информация
Chip-type white LED uses a ceramic package with silicone resin containing phosphor and gold-plated electrodes. It operates from -30 °C to 85 °C with a 35 mA maximum forward current and 123 mW maximum power dissipation. The device has a typical 3.2 V forward voltage at 20 mA and a maximum 3.5 V forward voltage. Typical luminous intensity is 1350 mcd at 20 mA, with x and y chromaticity coordinates of 0.31 and 0.32. Reflow soldering is supported up to 260 °C for 10 seconds, and tape-and-reel packaging provides 2,500 pieces per reel.
| RoHS | Yes |
| REACH | unknown |
| HTS Code | 8541.40.20.00 |
| LED Color | White |
| Lead Free | Yes |
| Military Spec | False |
| Forward Current | 35 maxmA |
| Forward Voltage | 3.2 typ, 3.5 max at IF=20 mAV |
| Reverse Current | 50 max at VR=5 VµA |
| Reverse Voltage | 5 maxV |
| Package Material | Ceramics |
| Power Dissipation | 123 maxmW |
| Electrode Material | Au plating |
| Luminous Intensity | 1350 typ at IF=20 mAmcd |
| Encapsulating Resin | Silicone resin with phosphor |
| Storage Temperature | -40 to 100°C |
| Operating Temperature | -30 to 85°C |
| Pulse Forward Current | 110 maxmA |
| Chromaticity Coordinate x | 0.31 typ at IF=20 mA |
| Chromaticity Coordinate y | 0.32 typ at IF=20 mA |
| Luminous Intensity Rank V | 880 to 1240mcd |
| Luminous Intensity Rank W | 1240 to 1760mcd |
| Hand Soldering Temperature | 350 max for 3 s°C |
| Reflow Soldering Temperature | 260 max for 10 s°C |
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