OMAP3530ECBB

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OMAP3530ECBB - Texas Instruments
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Краткое описание: SoC, ARM Cortex A8, 600MHz, 65nm, 515-Pin BGA
Производитель Texas Instruments
Статус производства Производится (ACTIVE)

Дополнительная информация

System on Chip (SoC) Applications Processor featuring an ARM Cortex A8 core, operating at up to 600 MHz. This 65nm process technology device offers 64KB RAM and 112KB ROM, with a 32-bit data bus. The 515-pin POP-FCBGA package utilizes ball grid array mounting, measuring 12.1mm x 12.1mm x 0.68mm with a 0.4mm pin pitch. It supports dual 10-bit DACs and includes multiple I2C, SPI, UART, and USB interfaces, along with 188 programmable I/Os.
CAN 0
I2C 3
I2S 0
PCB 515
SPI 1
USB 4
ECCN 5A992.c
PPAP No
Type Applications Processor
UART 3
USART 0
EU RoHS Yes
Ethernet 0
HTS Code 8542310001
Mounting Surface Mount
RAM Size 64KB
Cage Code 01295
Pin Count 515
Automotive No
Lead Shape Ball
Schedule B 8542310000
Application Portable Navigation Devices/Portable Media Player/Advanced Portable Consumer Electronics/Digital TV/Digital Video Camera/Portable Data Collection/Point-of-Sale Devices/Gaming/Web Tablet/Smart White Goods/Smart Home Controllers/Ultra Mobile Devices
Device Core ARM Cortex A8
Family Name OMAP3
Package/Case POP-FCBGA
AEC Qualified No
Maximum Speed 600MHz
RoHS Versions 2011/65/EU, 2015/863
DAC Resolution 10/10bit
Data Bus Width 32bit
Interface Type I2C/SPI/UART/USB
Number of DACs Dual
Pin Pitch (mm) 0.4
Processing Unit Microprocessor
Programmability Yes
Number of Timers 13
Package Material Plastic
Core Architecture ARM
Basic Package Type Ball Grid Array
Maximum Clock Rate 600MHz
Package Width (mm) 12.1(Max)
Process Technology 65nm
Package Height (mm) 0.68(Max)
Package Length (mm) 12.1(Max)
Program Memory Size 112KB
Program Memory Type ROM
Seated Plane Height (mm) 0.9(Max)
Max Operating Temperature 90°C
Min Operating Temperature 0°C
Number of Programmable I/Os 188
Max Operating Supply Voltage 1.89V
Typical Operating Supply Voltage 1.8V

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