S25FL512SDPBHIC13
Производится
Увеличить
Краткое описание:
512Mb NOR Flash SPI BGA 24-Pin 3.3V 14.5ns
Дополнительная информация
512M-bit NOR Flash memory with Serial (SPI, Dual SPI, Quad SPI) interface, supporting 3V/3.3V operation. Features 14.5ns maximum access time and a 24-pin BGA package for surface mounting. Offers 512M/256M/128M word configurations with 1, 2, or 4 bits per word, and includes boot block capability at the bottom or top. Operates across a -40°C to 85°C temperature range with a maximum operating current of 100mA.
| PCB | 24 |
| ECCN | 3A991.b.1.a |
| PPAP | No |
| Density | 512Mbit |
| EU RoHS | Yes |
| HTS Code | 8542320051 |
| Mounting | Surface Mount |
| Cage Code | 65786 |
| Pin Count | 24 |
| Automotive | No |
| Boot Block | Yes |
| Lead Shape | Ball |
| Schedule B | 8542320050 |
| Timing Type | Synchronous |
| Architecture | Sectored |
| Package/Case | BGA |
| AEC Qualified | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Interface Type | Serial (SPI, Dual SPI, Quad SPI) |
| Pin Pitch (mm) | 1 |
| Number of Words | 512M/256M/128M |
| Package Material | Plastic |
| Address Bus Width | 32bit |
| Basic Package Type | Ball Grid Array |
| Block Organization | Symmetrical |
| Package Width (mm) | 6 |
| Maximum Access Time | 14.5ns |
| Package Description | Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 1.2(Max) - 0.2(Min) |
| Package Length (mm) | 8 |
| Programming Voltage | 2.7 to 3.6V |
| Location of Boot Block | Bottom|Top |
| Number of Bits per Word | 1/2/4bit |
| Seated Plane Height (mm) | 1.2(Max) |
| Max Operating Temperature | 85°C |
| Maximum Operating Current | 100mA |
| Min Operating Temperature | -40°C |
| Typical Operating Supply Voltage | 3|3.3V |
Если у вас не открывается документ, нажмите, чтобы открыть файл в новой вкладке.
