SF-1206HIA300M-2

SF-1206HIA300M-2 - Bourns
Краткое описание: Fuse Chip 3A 32V SMD Solder Pad 3.2 X 1.6 X 0.97mm Ceramic T/R Automotive

Дополнительная информация

Fuse Chip 3A 32V SMD Solder Pad 3.2 X 1.6 X 0.97mm Ceramic T/R Automotive
RoHS Yes
Type Chip
RoHS Version 2011/65/EU, 2015/863
Current Rating 3A
Voltage Rating 32V
Termination Style Solder Pad
Number of Terminals 2
Typical Melting I2t 1.36A²s
Typical Cold Resistance 0.039Ohm
Max Operating Temperature 150°C
Min Operating Temperature -55°C