SM470R1B1MHFQS
Дополнительная информация
| CAN | 2 |
| I2C | 2 |
| I2S | 0 |
| PCB | 84 |
| SPI | 2 |
| USB | 0 |
| ECCN | 3A001.a.2.a |
| PPAP | No |
| UART | 0 |
| USART | 0 |
| EU RoHS | No |
| Ethernet | 0 |
| HTS Code | 8542310001 |
| Mounting | Surface Mount |
| RAM Size | 64KB |
| Cage Code | 01295 |
| Pin Count | 84 |
| Automotive | No |
| Lead Shape | Flat |
| Schedule B | 8542310000 |
| Device Core | ARM7TDMI |
| Family Name | Hercules TMS470M |
| ADC Channels | 12 |
| Package/Case | CFPAK |
| AEC Qualified | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Data Bus Width | 16|32bit |
| Interface Type | CAN/I2C/SCI/SPI |
| Number of ADCs | Single |
| Pin Pitch (mm) | 0.5 |
| Programmability | Yes |
| Number of Timers | 1 |
| Package Material | Ceramic |
| Core Architecture | ARM |
| Basic Package Type | Lead-Frame SMT |
| Maximum Clock Rate | 60MHz |
| Package Width (mm) | 13.8 |
| Package Description | Ceramic Flat Package |
| Package Family Name | FPAK |
| Package Height (mm) | 2.67 |
| Package Length (mm) | 13.8 |
| Program Memory Size | 1MB |
| Program Memory Type | Flash |
| Radiation Hardening | No |
| Maximum CPU Frequency | 60MHz |
| Seated Plane Height (mm) | 3(Max) |
| Max Operating Temperature | 220°C |
| Min Operating Temperature | -55°C |
| Number of Programmable I/Os | 93 |
| Instruction Set Architecture | RISC |
| Max Operating Supply Voltage | 2.05|3.6V |
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