SPC5673KF0VMM1
Производится
Увеличить
Краткое описание:
32-bit RISC MCU 1MB Flash 150MHz e200 257-Pin MAP-BGA
Дополнительная информация
32-bit RISC microcontroller featuring an e200 core, 1MB Flash program memory, and 256KB RAM. Operates at a maximum clock rate of 150 MHz with support for CAN, Ethernet, I2C, and SPI interfaces. Housed in a 257-pin MAP-BGA package with surface mount technology, this automotive-grade component offers a wide operating temperature range of -40°C to 105°C and supports supply voltages from 3.3V to 5V. Includes quad ADCs with 22 channels each and 5 timers.
| CAN | 4 |
| I2C | 2 |
| I2S | 0 |
| PCB | 257 |
| SPI | 2 |
| USB | 0 |
| ECCN | 3A991.a.2 |
| UART | 0 |
| USART | 0 |
| EU RoHS | Yes |
| Ethernet | 1 |
| HTS Code | 8542310001 |
| Mounting | Surface Mount |
| RAM Size | 256KB |
| Cage Code | H1R01 |
| Pin Count | 257 |
| Automotive | Yes |
| Lead Shape | Ball |
| Schedule B | 8542310000 |
| Device Core | e200 |
| Family Name | MPC56xx |
| ADC Channels | 22/22/22/22 |
| Package/Case | MAP-BGA |
| AEC Qualified | Yes |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Data Bus Width | 32bit |
| Interface Type | CAN/Ethernet/I2C/SCI/SPI |
| Number of ADCs | Quad |
| Pin Pitch (mm) | 0.8 |
| Programmability | Yes |
| Number of Timers | 5 |
| Package Material | Plastic |
| Core Architecture | e200 |
| Basic Package Type | Ball Grid Array |
| Maximum Clock Rate | 150MHz |
| Package Weight (g) | 0.4072 |
| Package Width (mm) | 14 |
| Package Description | Molded Array Process Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 1.17(Max) |
| Package Length (mm) | 14 |
| Program Memory Size | 1MB |
| Program Memory Type | Flash |
| Maximum CPU Frequency | 150MHz |
| Seated Plane Height (mm) | 1.51(Max) |
| Max Operating Temperature | 105°C |
| Min Operating Temperature | -40°C |
| Number of Programmable I/Os | 16 |
| Instruction Set Architecture | RISC |
| Max Operating Supply Voltage | 3.6|5.5V |
Если у вас не открывается документ, нажмите, чтобы открыть файл в новой вкладке.
