STM32F103RDH6
Снят с производства
Краткое описание:
32-bit ARM Cortex M3 MCU, 72MHz, 384KB Flash, 64-Pin LFBGA
Дополнительная информация
32-bit ARM Cortex M3 RISC microcontroller featuring 384KB Flash program memory and 64KB RAM. Operates at a maximum clock rate of 72 MHz with 51 programmable I/Os. Includes multiple interfaces such as CAN, I2C, SPI, USART, and USB. Packaged in a 64-pin LFBGA for surface mounting, with an operating temperature range of -40°C to 85°C. Offers triple ADCs with 16-bit resolution and dual 12-bit DACs.
| CAN | 1 |
| I2C | 2 |
| I2S | 0 |
| PCB | 64 |
| SPI | 3 |
| USB | 1 |
| PPAP | No |
| UART | 0 |
| USART | 5 |
| Ethernet | 0 |
| HTS Code | 8542310001 |
| Mounting | Surface Mount |
| RAM Size | 64KB |
| Cage Code | SCR76 |
| Pin Count | 64 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542310000 |
| Device Core | ARM Cortex M3 |
| Family Name | STM32F |
| ADC Channels | 16/16/16 |
| DAC Channels | 2/2 |
| Package/Case | LFBGA |
| AEC Qualified | No |
| RoHS Versions | 2002/95/EC |
| DAC Resolution | 12/12bit |
| Data Bus Width | 32bit |
| Interface Type | CAN/I2C/SPI/USART/USB |
| Number of ADCs | Triple |
| Number of DACs | Dual |
| Programmability | Yes |
| Number of Timers | 8 |
| Package Material | Plastic |
| Core Architecture | ARM |
| Basic Package Type | Ball Grid Array |
| Maximum Clock Rate | 72MHz |
| Package Description | Low Profile Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Program Memory Size | 384KB |
| Program Memory Type | Flash |
| Radiation Hardening | No |
| Maximum CPU Frequency | 72MHz |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Number of Programmable I/Os | 51 |
| Instruction Set Architecture | RISC |
| Max Operating Supply Voltage | 3.6V |
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