TC74HC112AFN(ELPM)

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TC74HC112AFN(ELPM) - Toshiba
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Краткое описание: HC CMOS JK Flip-Flop, 2-Element, 16-Pin SOL, Surface Mount
Производитель Toshiba
Категория Шлёпанцы
Статус производства Снят с производства (OBSOLETE)

Дополнительная информация

Dual JK-type flip-flop IC featuring negative-edge triggering and CMOS logic family. This 16-pin Small Outline IC (SOL) with gull-wing leads is designed for surface mounting on PCBs. It operates within a temperature range of -40°C to 85°C and offers 2 elements per chip, each with 2 inputs and 1 output. The lead-frame SMT package measures 9.9mm x 3.9mm x 1.38mm with a 1.27mm pin pitch.
PCB 16
ECCN EAR99
PPAP No
EU RoHS No
HTS Code 8542390001
Mounting Surface Mount
Polarity Inverting/Non-Inverting
Cage Code S0562
Pin Count 16
Automotive No
Lead Shape Gull-wing
Schedule B 8542390000
Logic Family HC
Package/Case SOL
AEC Qualified No
RoHS Versions 2011/65/EU, 2015/863
Logic Function JK-Type
Pin Pitch (mm) 1.27
Triggering Type Negative-Edge
Package Material Plastic
Basic Package Type Lead-Frame SMT
Package Width (mm) 3.9
Process Technology CMOS
Package Description Small Outline IC (L Lead)
Package Family Name SOP
Package Height (mm) 1.38
Package Length (mm) 9.9
Radiation Hardening No
Number of Element Inputs 2
Seated Plane Height (mm) 1.75(Max)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Number of Element Outputs 1
Number of Elements per Chip 2

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