TC74HC175AP(M)

Снят с производства
TC74HC175AP(M) - Toshiba
Краткое описание: HC CMOS D-Type Flip-Flop, 16-Pin PDIP, Positive-Edge
Производитель Toshiba
Категория Шлёпанцы
Статус производства Снят с производства (OBSOLETE)

Дополнительная информация

CMOS D-Type Bus Interface Flip-Flop, positive-edge triggered, featuring one element with four inputs and four outputs. This 16-pin PDIP package, with a 2.54mm pin pitch, is designed for through-hole mounting and operates within a temperature range of -40°C to 85°C. The plastic dual in-line package conforms to JEDEC MS-001BB standards.
PCB 16
ECCN EAR99
PPAP No
Jedec MS-001BB
EU RoHS Yes
HTS Code 8542390001
Mounting Through Hole
Polarity Inverting/Non-Inverting
Cage Code S0562
Pin Count 16
Automotive No
Lead Shape Through Hole
Schedule B 8542390000
Logic Family HC
Package/Case PDIP
AEC Qualified No
RoHS Versions 2011/65/EU, 2015/863
Logic Function D-Type Bus Interface
Pin Pitch (mm) 2.54
Triggering Type Positive-Edge
Package Material Plastic
Basic Package Type Through Hole
Package Width (mm) 6.4
Process Technology CMOS
Package Description Plastic Dual In Line Package
Package Family Name DIP
Package Height (mm) 3.5
Package Length (mm) 19.75(Max)
Radiation Hardening No
Number of Element Inputs 4
Seated Plane Height (mm) 4.15
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Number of Element Outputs 4
Number of Elements per Chip 1

Если у вас не открывается документ, нажмите, чтобы открыть файл в новой вкладке.