TC74HC273AP(TB,F)

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TC74HC273AP(TB,F) - Toshiba
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Краткое описание: HC CMOS D-Type Flip-Flop, 1-Element, 20-Pin PDIP, Through Hole
Производитель Toshiba
Статус производства Производится (ACTIVE)

Дополнительная информация

Positive-edge triggered D-type bus interface flip-flop, featuring a single 8-input, 8-output element. This CMOS logic IC operates within a -40°C to 85°C temperature range and is housed in a 20-pin PDIP plastic dual in-line package with through-hole mounting. The package measures 25.1mm (max) in length, 6.4mm in width, and 3.5mm in height, with a 2.54mm pin pitch, conforming to the MS-001AD JEDEC standard.
PCB 20
ECCN EAR99
PPAP No
Jedec MS-001AD
EU RoHS Yes
HTS Code 8542390001
Mounting Through Hole
Polarity Non-Inverting
Cage Code S0562
Pin Count 20
Automotive No
Lead Shape Through Hole
Schedule B 8542390000
Logic Family HC
Package/Case PDIP
AEC Qualified No
RoHS Versions 2011/65/EU, 2015/863
Logic Function D-Type Bus Interface
Pin Pitch (mm) 2.54
Triggering Type Positive-Edge
Package Material Plastic
Basic Package Type Through Hole
Package Width (mm) 6.4
Process Technology CMOS
Package Description Plastic Dual In Line Package
Package Family Name DIP
Package Height (mm) 3.5
Package Length (mm) 25.1(Max)
Radiation Hardening No
Number of Element Inputs 8
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Number of Element Outputs 8
Number of Elements per Chip 1

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