TC74HCT74AFN(ELPM)

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TC74HCT74AFN(ELPM) - Toshiba
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Краткое описание: D-Type Flip-Flop, 2-Element, HCT Logic, 14-Pin SOP, SMT
Производитель Toshiba
Статус производства Снят с производства (OBSOLETE)

Дополнительная информация

Surface mount D-type flip-flop IC featuring two independent elements, each with a single input and output. This logic IC utilizes HCT CMOS technology and positive-edge triggering for reliable data capture. Packaged in a 14-pin SOL (SOP) plastic small outline package with gull-wing leads, it offers a 1.27mm pin pitch and is designed for surface mounting. Operating temperature range spans from -40°C to 85°C.
PCB 14
ECCN EAR99
PPAP No
Jedec MS-012AB
EU RoHS No
HTS Code 8542390001
Mounting Surface Mount
Polarity Inverting/Non-Inverting
Cage Code S0562
Pin Count 14
Automotive No
Lead Shape Gull-wing
Schedule B 8542390000
Logic Family HCT
Package/Case SOL
AEC Qualified No
RoHS Versions 2011/65/EU, 2015/863
Logic Function D-Type
Pin Pitch (mm) 1.27
Triggering Type Positive-Edge
Package Material Plastic
Basic Package Type Lead-Frame SMT
Package Width (mm) 3.9
Process Technology CMOS
Package Description Small Outline IC (L Lead)
Package Family Name SOP
Package Height (mm) 1.38
Package Length (mm) 8.65
Radiation Hardening No
Number of Element Inputs 1
Seated Plane Height (mm) 1.75(Max)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Number of Element Outputs 1
Number of Elements per Chip 2

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