TC74VHC374FT(SOE)
Снят с производства
Увеличить
Краткое описание:
VHC D-Type Flip-Flop, 3-State, 20-Pin TSSOP, SMT
Дополнительная информация
Positive-edge triggered, non-inverting D-type bus interface flip-flop, featuring 8 inputs and 8 3-state outputs. This CMOS logic IC operates within a -40°C to 85°C temperature range. Packaged in a 20-pin TSSOP (Thin Shrink Small Outline Package) with gull-wing leads for surface mounting, it utilizes a lead-frame SMT basic package type conforming to JEDEC MO-153AC. The package dimensions are 6.9mm (Max) length, 4.4mm width, and 1mm height, with a 0.65mm pin pitch.
| PCB | 20 |
| ECCN | EAR99 |
| PPAP | No |
| Jedec | MO-153AC |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| Polarity | Non-Inverting |
| Cage Code | S0562 |
| Pin Count | 20 |
| Automotive | No |
| Lead Shape | Gull-wing |
| Schedule B | 8542390000 |
| Output Type | 3-State |
| Logic Family | VHC |
| Package/Case | TSSOP |
| AEC Qualified | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Logic Function | D-Type Bus Interface |
| Pin Pitch (mm) | 0.65 |
| Triggering Type | Positive-Edge |
| Package Material | Plastic |
| Basic Package Type | Lead-Frame SMT |
| Package Width (mm) | 4.4 |
| Process Technology | CMOS |
| Package Description | Thin Shrink Small Outline Package |
| Package Family Name | SOP |
| Package Height (mm) | 1 |
| Package Length (mm) | 6.9(Max) |
| Radiation Hardening | No |
| Number of Element Inputs | 8 |
| Seated Plane Height (mm) | 1.2(Max) |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Number of Element Outputs | 8 |
| Number of Elements per Chip | 1 |
Если у вас не открывается документ, нажмите, чтобы открыть файл в новой вкладке.
