TDA8024AT/C1,112

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TDA8024AT/C1,112 - NXP
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Краткое описание: Smart Card Interface IC, 3.2MHz, 3.3/5V, 28-Pin SOIC
Производитель NXP
Статус производства Снят с производства (OBSOLETE)

Дополнительная информация

Smart card interface IC supporting EMV/ISO 7816/GSM11-11 standards. Features a maximum clock frequency of 3.2 MHz and operates with dual supply voltages of 3.3V or 5V, with a maximum supply voltage of 6.5V and minimum of 2.7V. Maximum power dissipation is 560 mW with a maximum supply current of 80 mA. Housed in a 28-pin SO package with gull-wing leads, this surface-mount component has a pin pitch of 1.27 mm and operates within a temperature range of -25°C to 85°C.
PCB 28
ECCN EAR99
PPAP No
Jedec MS-013AE
EU RoHS Yes
HTS Code 8542390001
Mounting Surface Mount
Cage Code H1R01
Pin Count 28
Automotive No
Lead Shape Gull-wing
Schedule B 8542390000
Package/Case SO
AEC Qualified No
RoHS Versions 2011/65/EU, 2015/863
Pin Pitch (mm) 1.27
Package Material Plastic
Basic Package Type Lead-Frame SMT
Package Width (mm) 7.6(Max)
Standard Supported EMV/ISO 7816/GSM11-11
Package Description Small Outline IC
Package Family Name SOP
Package Height (mm) 2.45(Max)
Package Length (mm) 18.1(Max)
Maximum Supply Current 80mA
Maximum Clock Frequency 3.2MHz
Seated Plane Height (mm) 2.65(Max)
Max Operating Temperature 85°C
Maximum Power Dissipation 560mW
Min Operating Temperature -25°C
Max Operating Supply Voltage 6.5V
Min Operating Supply Voltage 2.7V
Typical Operating Supply Voltage 3.3|5V

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