TLP114A(IGM-TPL)

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TLP114A(IGM-TPL) - Toshiba
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Краткое описание: DC Optocoupler, 1-CH Transistor Output, 3750Vrms, MFSOP, SMT
Производитель Toshiba
Статус производства Снят с производства (OBSOLETE)

Дополнительная информация

Surface mount optocoupler featuring a single-channel DC input and DC output with a transistor and base. This 5-pin MFSOP package offers 3750 Vrms isolation, a minimum current transfer ratio of 20%, and operates within a -55°C to 100°C temperature range. The gull-wing lead-frame design facilitates efficient surface mounting, with package dimensions of 3.6mm x 4.4mm x 2.5mm and a 1.27mm pin pitch. Maximum specifications include 1.72V forward voltage, 8mA collector current, and 5V reverse voltage, with a power dissipation of 100mW.
PCB 5
ECCN EAR99
PPAP No
HTS Code 8541408000
Mounting Surface Mount
Cage Code S0562
Pin Count 5
Automotive No
Input Type DC
Lead Shape Gull-wing
Schedule B 8541408000
Output Type DC
Package/Case MFSOP
AEC Qualified No
Output Device Transistor With Base
Pin Pitch (mm) 1.27
Package Material Plastic
Basic Package Type Lead-Frame SMT
Package Width (mm) 4.4
Package Height (mm) 2.5
Package Length (mm) 3.6
Radiation Hardening No
Maximum Forward Voltage 1.72V
Maximum Reverse Voltage 5V
Seated Plane Height (mm) 2.6
Max Operating Temperature 100°C
Maximum Collector Current 8mA
Maximum Power Dissipation 100mW
Min Operating Temperature -55°C
Minimum Isolation Voltage 3750Vrms
Number of Channels per Chip 1
Minimum Current Transfer Ratio 20%

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