TLV2252AMUB
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Dual Op Amp, Low Power, R-R Out, 0.2MHz, 10-Pin CFPAK SMT
Дополнительная информация
Dual low-power operational amplifier featuring rail-to-rail output. This integrated circuit utilizes LinCMOS process technology and offers a typical gain bandwidth product of 0.2 MHz. Housed in a 10-pin Ceramic Flat Package (CFPAK) with a lead-frame SMT mounting style, it supports surface mounting with a 1.27mm pin pitch. Operating temperature range is -55°C to 125°C, with supply voltage options including single 3V/5V and dual ±1.35V to ±4V.
| PCB | 10 |
| ECCN | EAR99 |
| PPAP | No |
| Type | Low Power Amplifier |
| EU RoHS | No |
| HTS Code | 8542330001 |
| Mounting | Surface Mount |
| Cage Code | 01295 |
| Pin Count | 10 |
| Automotive | No |
| Lead Shape | Flat |
| Schedule B | 8542330000 |
| Output Type | CMOS |
| Package/Case | CFPAK |
| Rail to Rail | Rail to Rail Output |
| AEC Qualified | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 1.27 |
| Package Material | Ceramic |
| Manufacturer Type | Low Power Amplifier |
| Basic Package Type | Lead-Frame SMT |
| Package Width (mm) | 6.35(Max) |
| Process Technology | LinCMOS |
| Package Description | Ceramic Flat Package |
| Package Family Name | FPAK |
| Package Height (mm) | 2.03(Max) |
| Package Length (mm) | 7.11(Max) |
| Radiation Hardening | No |
| Seated Plane Height (mm) | 2.03(Max) |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -55°C |
| Maximum Input Bias Current | 0.00006@±2.5VuA |
| Maximum Dual Supply Voltage | ±4V |
| Minimum Dual Supply Voltage | ±1.35V |
| Number of Channels per Chip | 2 |
| Typical Dual Supply Voltage | ±3V |
| Max Operating Supply Voltage | ±4|8V |
| Maximum Input Offset Current | 0.00006@±2.5VuA |
| Maximum Input Offset Voltage | 0.85@±2.5VmV |
| Maximum Supply Voltage Range | 6 to 9V |
| Maximum Single Supply Voltage | 8V |
| Minimum Single Supply Voltage | 2.7V |
| Typical Single Supply Voltage | 3|5V |
| Typical Gain Bandwidth Product | 0.2MHz |
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