TMS320C6454BCTZ7
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Краткое описание:
DSP 32-bit 720MHz 8000MIPS FCBGA 697-Pin Fixed-Point
Дополнительная информация
High-performance 32-bit fixed-point Digital Signal Processor (DSP) operating at 720 MHz, delivering 8000 MIPS. Features an Advanced VLIW instruction set architecture and a C64x device core. This ROMLess DSP is housed in a 697-pin Flip Chip Ball Grid Array (FCBGA) package with a 0.8mm pin pitch, designed for surface mounting. Includes Ethernet and I2C interface support, with a wide operating temperature range of 0°C to 90°C.
| CAN | 0 |
| I2C | 1 |
| I2S | 0 |
| PCB | 697 |
| SPI | 0 |
| USB | 0 |
| ECCN | 3A991.a.2 |
| PPAP | No |
| UART | 0 |
| USART | 0 |
| EU RoHS | Yes |
| Ethernet | 1 |
| HTS Code | 8542310001 |
| Mounting | Surface Mount |
| Cage Code | 01295 |
| Pin Count | 697 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542310000 |
| Device Core | C64x |
| Family Name | C6000 |
| Package/Case | FCBGA |
| AEC Qualified | No |
| Maximum Speed | 720MHz |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Data Bus Width | 32bit |
| Interface Type | Ethernet/I2C |
| Pin Pitch (mm) | 0.8 |
| Programmability | No |
| Package Material | Plastic |
| Basic Package Type | Ball Grid Array |
| Package Width (mm) | 24.1(Max) |
| Package Description | Flip Chip Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 2.74(Max) |
| Package Length (mm) | 24.1(Max) |
| Program Memory Type | ROMLess |
| Device Input Clock Speed | 720MHz |
| Seated Plane Height (mm) | 3.24(Max) |
| Max Operating Temperature | 90°C |
| Min Operating Temperature | 0°C |
| Number of Programmable I/Os | 16 |
| Instruction Set Architecture | Advanced VLIW |
| Numeric and Arithmetic Format | Fixed-Point |
| Typical Operating Supply Voltage | 1.2|1.5|1.8|3.3V |
| Device Million Instructions per Second | 8000MIPS |
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