TMS320DM6467TZUTD1
Снят с производства
Увеличить
Краткое описание:
DSP 32bit 500MHz 8000MIPS FCBGA 529-Pin 1.3V
Дополнительная информация
32-bit RISC Digital Signal Processor (DSP) operating at 500 MHz, delivering 8000 MIPS. Features an ARM926EJ-S core with 8KB ROM and 32KB RAM. Surface-mount Flip Chip Ball Grid Array (FCBGA) package with 529 pins, measuring 19x19x2.65mm, and a 0.8mm pin pitch. Supports I2C, SPI, UART, and USB interfaces, with a typical operating voltage of 1.3V and an operating temperature range of -40°C to 85°C.
| CAN | 0 |
| I2C | 1 |
| I2S | 0 |
| PCB | 529 |
| SPI | 1 |
| USB | 1 |
| PPAP | No |
| UART | 3 |
| USART | 0 |
| EU RoHS | Yes with Exemption |
| Ethernet | 0 |
| HTS Code | 8542310001 |
| Mounting | Surface Mount |
| RAM Size | 32KB |
| Cage Code | 01295 |
| Pin Count | 529 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542310000 |
| Device Core | ARM926EJ-S |
| Family Name | TMS320 |
| Package/Case | FCBGA |
| AEC Qualified | No |
| Maximum Speed | 500MHz |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Data Bus Width | 32bit |
| Interface Type | I2C/SPI/UART/USB |
| Pin Pitch (mm) | 0.8 |
| Programmability | Yes |
| Package Material | Plastic |
| Basic Package Type | Ball Grid Array |
| Package Width (mm) | 19 |
| Package Description | Flip Chip Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 2.65 |
| Package Length (mm) | 19 |
| Program Memory Size | 8KB |
| Program Memory Type | ROM |
| Radiation Hardening | No |
| Device Input Clock Speed | 500MHz |
| Seated Plane Height (mm) | 3.3(Max) |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Number of Programmable I/Os | 33 |
| Instruction Set Architecture | RISC |
| Typical Operating Supply Voltage | 1.3V |
| Device Million Instructions per Second | 8000MIPS |
Если у вас не открывается документ, нажмите, чтобы открыть файл в новой вкладке.
