TPS65720YFFR
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Краткое описание:
25-Pin BGA Power Management Multi-Channel IC, 1.8-5.6V, -40-85°C
Дополнительная информация
The TPS65720YFFR is a 25-pin ball grid array power management multi-channel IC from Texas Instruments. It operates over a temperature range of -40°C to 85°C and accepts input voltages between 1.8V and 5.6V. This device is designed for surface mount applications and features a plastic package with a maximum seated plane height of 0.63mm.
| PCB | 25 |
| ECCN | EAR99 |
| PPAP | No |
| EU RoHS | Yes |
| Function | Power Management Multi-Channel IC |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| Cage Code | 01295 |
| Pin Count | 25 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542390000 |
| Package/Case | DSBGA |
| AEC Qualified | No |
| Input Voltage | 1.8 to 5.6V |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 0.4 |
| Package Material | Plastic |
| Basic Package Type | Ball Grid Array |
| Package Width (mm) | 2.12(Max) |
| Package Description | Die Size Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 0.33(Max) |
| Package Length (mm) | 2.12(Max) |
| Radiation Hardening | No |
| Seated Plane Height (mm) | 0.63(Max) |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
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