TS391SNL250
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Краткое описание:
Thermally Stable Solder Paste, No-Clean Sn96.5/Ag3.0/Cu0.5 T4 (250g Jar)
Дополнительная информация
A thermally stable, no-clean, lead-free solder paste using the SAC305 alloy. It features a revolutionary formula that requires no refrigeration and can be stored at room temperature. It offers a stencil life of over 12 hours and provides consistent print volumes with high-speed printing up to 150mm/s.
| RoHS | Compliant / Lead-Free |
| Alloy | Sn96.5/Ag3.0/Cu0.5 (SAC305) |
| REACH | No SVHC |
| Flux Type | Synthetic No-Clean |
| Shelf Life | 12months |
| Stencil Life | 12hours |
| Melting Point | 217-220C |
| Metal Content | 88.5% |
| Particle Size | 20-38 (T4)microns |
| Flux Classification | ROL0 |
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