TSM3N90CP ROG
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Краткое описание:
900V N-CH MOSFET, 2.5A, DPAK, Surface Mount
Дополнительная информация
N-channel enhancement mode power MOSFET, 900V drain-source voltage, 2.5A continuous drain current. Features a 3-pin DPAK (TO-252) lead-frame SMT package with gull-wing leads for surface mounting. Maximum gate-source voltage is ±30V, with a gate threshold voltage of 4V. Offers a maximum drain-source on-resistance of 5100 mOhm at 10V, and a maximum power dissipation of 94W.
| PCB | 2 |
| Tab | Tab |
| ECCN | EAR99 |
| PPAP | No |
| EU RoHS | Yes |
| Category | Power MOSFET |
| HTS Code | 8541290095 |
| Mounting | Surface Mount |
| Cage Code | SDM41 |
| Pin Count | 3 |
| Automotive | No |
| Lead Shape | Gull-wing |
| Schedule B | 8541290080 |
| Channel Mode | Enhancement |
| Channel Type | N |
| Package/Case | DPAK |
| AEC Qualified | No |
| Configuration | Single |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 2.3 |
| Package Material | Plastic |
| Basic Package Type | Lead-Frame SMT |
| Package Width (mm) | 5.7(Max) |
| Package Description | Deca Watt Package |
| Package Family Name | TO-252 |
| Package Height (mm) | 2.5(Max) |
| Package Length (mm) | 6.7(Max) |
| Seated Plane Height (mm) | 2.7(Max) |
| Max Operating Temperature | 150°C |
| Maximum Power Dissipation | 94000mW |
| Min Operating Temperature | -55°C |
| Typical Gate Charge @ 10V | 17nC |
| Typical Gate Charge @ Vgs | 17@10VnC |
| Maximum Gate Source Voltage | ±30V |
| Number of Elements per Chip | 1 |
| Maximum Drain Source Voltage | 900V |
| Maximum Gate Threshold Voltage | 4V |
| Maximum Drain Source Resistance | 5100@10VmOhm |
| Typical Input Capacitance @ Vds | 748@25VpF |
| Maximum Continuous Drain Current | 2.5A |
