N-channel/P-channel enhancement mode silicon power MOSFETs with 30V/20V drain-source voltage and 2.5A continuous drain current. Features 8-pin TSST lead-frame SMT package with flat leads, 0.65mm pin pitch, and surface mount capability. Maximum power dissipation is 1250mW, with operating temperatures from -55°C to 150°C.
| PCB |
8 |
| ECCN |
EAR99 |
| PPAP |
No |
| EU RoHS |
Yes |
| Category |
Power MOSFET |
| HTS Code |
8541290095 |
| Material |
Si |
| Mounting |
Surface Mount |
| Cage Code |
S5518 |
| Pin Count |
8 |
| Automotive |
No |
| Lead Shape |
Flat |
| Schedule B |
8541290080 |
| Channel Mode |
Enhancement |
| Channel Type |
N|P |
| Package/Case |
TSST |
| AEC Qualified |
No |
| Configuration |
Single Dual Drain |
| RoHS Versions |
2011/65/EU, 2015/863 |
| Pin Pitch (mm) |
0.65 |
| Package Material |
Plastic |
| Basic Package Type |
Lead-Frame SMT |
| Package Width (mm) |
1.70(Max) |
| Package Family Name |
TSST |
| Package Height (mm) |
0.80(Max) |
| Package Length (mm) |
3.10(Max) |
| Radiation Hardening |
No |
| Seated Plane Height (mm) |
0.85(Max) |
| Max Operating Temperature |
150°C |
| Maximum Power Dissipation |
1250mW |
| Min Operating Temperature |
-55°C |
| Typical Gate Charge @ Vgs |
[email protected]@N Channel|[email protected]@P ChannelnC |
| Maximum Gate Source Voltage |
±12@N Channel|±10@P ChannelV |
| Number of Elements per Chip |
1 |
| Maximum Drain Source Voltage |
30@N Channel|20@P ChannelV |
| Maximum Drain Source Resistance |
[email protected]@N Channel|[email protected]@P ChannelmOhm |
| Typical Input Capacitance @ Vds |
180@10V@N Channel|1270@10V@P ChannelpF |
| Maximum Continuous Drain Current |
2.5A |