UBA1707TD

Снят с производства
UBA1707TD - NXP
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Краткое описание: 28-Pin SO Telecom IC, 3-5.5V, 2.2mA, -25-75°C
Производитель NXP
Статус производства Снят с производства (OBSOLETE)

Дополнительная информация

28-pin SO package, lead-frame SMT with gull-wing leads, this integrated circuit is designed for cordless telephone applications. It features a small outline IC package with a 1.27mm pin pitch, measuring 18.1mm maximum length, 7.6mm maximum width, and 2.45mm maximum height. Operating within a 3V to 5.5V supply voltage range, it consumes a typical supply current of 2.2mA. This plastic, surface-mount component is suitable for cable, copper, and twisted pair transmission media, with an operating temperature range of -25°C to 75°C.
PCB 28
PPAP No
Jedec MS-013AE
Category Cordless Telephone
Mounting Surface Mount
Cage Code H1R01
Pin Count 28
Automotive No
Lead Shape Gull-wing
Package/Case SO
AEC Qualified No
RoHS Versions 2002/95/EC
Pin Pitch (mm) 1.27
Package Material Plastic
Power Supply Type Analog
Basic Package Type Lead-Frame SMT
Package Width (mm) 7.6(Max)
Package Description Small Outline IC
Package Family Name SOP
Package Height (mm) 2.45(Max)
Package Length (mm) 18.1(Max)
Radiation Hardening No
Typical Supply Current 2.2mA
Transmission Media Type Cable|Copper|Twisted Pair
Seated Plane Height (mm) 2.65(Max)
Max Operating Temperature 75°C
Min Operating Temperature -25°C
Max Operating Supply Voltage 5.5V
Min Operating Supply Voltage 3V
Typical Operating Supply Voltage 3.3|5V

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