UCC2305TDWRQ1
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Краткое описание:
28-Pin SOIC Lead-Frame SMT Surface Mount Power Management IC
Дополнительная информация
The UCC2305TDWRQ1 is a 28-pin SOIC packaged power management IC from Texas Instruments. It features a lead-frame SMT package with a gull-wing lead shape and a seated plane height of 2.65mm. The IC is designed for surface mount applications and has a maximum package length of 18.1mm and a maximum package width of 7.6mm. The UCC2305TDWRQ1 is compliant with the Jedec MS-013AE standard.
| PCB | 28 |
| ECCN | EAR99 |
| Jedec | MS-013AE |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| Cage Code | 01295 |
| Pin Count | 28 |
| Automotive | Yes |
| Lead Shape | Gull-wing |
| Schedule B | 8542390000 |
| Package/Case | SOIC |
| AEC Qualified | Yes |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Basic Package Type | Lead-Frame SMT |
| Package Width (mm) | 7.6(Max) |
| Package Description | Small Outline IC |
| Package Family Name | SOP |
| Package Height (mm) | 2.35(Max) |
| Package Length (mm) | 18.1(Max) |
| Radiation Hardening | No |
| Seated Plane Height (mm) | 2.65(Max) |
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