High-speed QDR SRAM IC with 36Mbit density, organized as 4M words by 9 bits. Features a maximum clock frequency of 250MHz and a maximum access time of 0.45ns. Operates with dual supply voltages of 1.5/1.8V and 1.8V, with a nominal supply voltage of 1.8V. This surface-mount component utilizes CMOS technology and is housed in a 165-ball low-profile grid array package. It offers separate I/O and 3-state output characteristics, with a commercial temperature grade ranging from 0°C to 70°C.
| RoHS |
Compliant |
| Width |
15mm |
| Length |
17mm |
| Density |
37748736b |
| I/O Type |
SEPARATE |
| Technology |
CMOS |
| Memory Type |
QDR SRAM |
| JESD-30 Code |
R-PBGA-B165 |
| Memory Width |
9 |
| Organization |
4MX9 |
| Package Code |
LBGA |
| Package Shape |
Rectangular |
| Package Style |
GRID ARRAY, LOW PROFILEMeter |
| Surface Mount |
Yes |
| Terminal Form |
Ball |
| Power Supplies |
1.5/1.8,1.8V |
| RoHS Compliant |
Yes |
| Terminal Pitch |
1mm |
| Access Time-Max |
0.45ns |
| Number of Words |
4194304 |
| Parallel/Serial |
PARALLEL |
| Temperature Grade |
COMMERCIAL |
| Terminal Position |
BOTTOM |
| Max Supply Current |
460mA |
| Number of Functions |
1 |
| Standby Current-Max |
370mA |
| Standby Voltage-Min |
1.7V |
| Number of Words Code |
4M |
| Qualification Status |
Not Qualified |
| Height - Seated (Max) |
1.46mm |
| Package Body Material |
Plastic |
| Output Characteristics |
3-STATE |
| Package Equivalence Code |
BGA165,11X15,40 |
| Max Operating Temperature |
70°C |
| Min Operating Temperature |
0°C |
| Supply Voltage-Max (Vsup) |
1.9V |
| Supply Voltage-Min (Vsup) |
1.7V |
| Supply Voltage-Nom (Vsup) |
1.8V |
| Clock Frequency-Max (fCLK) |
250MHz |