V55C2256164VBLC8IPC
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Краткое описание:
256Mbit Mobile SDRAM 16Mx16 2.5V 54-Pin FBGA
Дополнительная информация
256Mbit Mobile SDRAM chip, organized as 16Mx16, features a 16-bit data bus and operates at a maximum clock rate of 125 MHz. This surface-mount component utilizes a 54-pin Fine Pitch Ball Grid Array (FBGA) package with dimensions of 13mm x 8mm x 0.8mm (Max). It offers 4 internal banks, each with 4M words, and supports a typical operating supply voltage of 2.5V, with a range of 2.3V to 2.9V. Operating across a temperature range of -40°C to 85°C, this DRAM chip is designed for high-density mobile applications.
| PCB | 54 |
| ECCN | EAR99 |
| Type | Mobile SDRAM |
| Density | 256Mbit |
| EU RoHS | No |
| HTS Code | 8542320024 |
| Mounting | Surface Mount |
| Pin Count | 54 |
| Lead Shape | Ball |
| Schedule B | 8542320015 |
| Organization | 16Mx16 |
| Package/Case | FBGA |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Data Bus Width | 16bit |
| Density in Bits | 268435456bit |
| Package Material | Plastic |
| Address Bus Width | 15bit |
| Basic Package Type | Ball Grid Array |
| Maximum Clock Rate | 125MHz |
| Package Width (mm) | 8 |
| Maximum Access Time | 19|6|6ns |
| Package Description | Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 0.8(Max) |
| Package Length (mm) | 13 |
| Radiation Hardening | No |
| Number of Internal Banks | 4 |
| Number of Words per Bank | 4M |
| Seated Plane Height (mm) | 1.2(Max) |
| Max Operating Temperature | 85°C |
| Maximum Operating Current | 90mA |
| Min Operating Temperature | -40°C |
| Max Operating Supply Voltage | 2.9V |
| Min Operating Supply Voltage | 2.3V |
| Typical Operating Supply Voltage | 2.5V |
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