V55C2256164VBLM10EPC
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Краткое описание:
16Mx16 Mobile SDRAM 256M 70mA 2.3-2.9V BGA Surface Mount
Дополнительная информация
The V55C2256164VBLM10EPC is a 16Mx16 Mobile SDRAM with a density of 256M bits, organized in 16Mx16 configuration. It operates at a maximum clock rate of 100 and has a maximum access time of 22|8|7. The device is supplied with a typical operating voltage of 2.5V and can withstand a maximum operating voltage of 2.9V and a minimum operating voltage of 2.3V. It is designed to operate within a temperature range of -40°C to 125°C and is mounted on a BGA package using surface mount technology.
| ECCN | EAR99 |
| Type | Mobile SDRAM |
| Density | 256Mbit |
| EU RoHS | Yes |
| HTS Code | 8542320024 |
| Mounting | Surface Mount |
| Lead Shape | Ball |
| Schedule B | 8542320015 |
| Organization | 16Mx16 |
| Package/Case | BGA |
| RoHS Versions | 2002/95/EC |
| Data Bus Width | 16bit |
| Density in Bits | 268435456bit |
| Package Material | Plastic |
| Address Bus Width | 15bit |
| Basic Package Type | Ball Grid Array |
| Maximum Clock Rate | 100MHz |
| Maximum Access Time | 22|8|7ns |
| Package Description | Plastic Ball Grid Array |
| Package Family Name | BGA |
| Radiation Hardening | No |
| Number of Internal Banks | 4 |
| Number of Words per Bank | 4M |
| Max Operating Temperature | 125°C |
| Maximum Operating Current | 70mA |
| Min Operating Temperature | -40°C |
| Max Operating Supply Voltage | 2.9V |
| Min Operating Supply Voltage | 2.3V |
| Typical Operating Supply Voltage | 2.5V |
