V55C2256164VBLS7E
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Краткое описание:
256Mbit Mobile SDRAM 16Mx16 2.5V 60-Pin FBGA
Дополнительная информация
256Mbit Mobile SDRAM chip, organized as 16Mx16, features a 16-bit data bus and a 15-bit address bus. Operating at a maximum clock rate of 143 MHz, this DRAM component offers 4 internal banks with 4M words per bank. It is housed in a 60-pin Fine Pitch Ball Grid Array (FBGA) package for surface mounting, with a typical operating supply voltage of 2.5V. This component supports a temperature range from -40°C to 125°C.
| PCB | 60 |
| ECCN | EAR99 |
| Type | Mobile SDRAM |
| Density | 256Mbit |
| EU RoHS | No |
| HTS Code | 8542320024 |
| Mounting | Surface Mount |
| Pin Count | 60 |
| Lead Shape | Ball |
| Schedule B | 8542320015 |
| Organization | 16Mx16 |
| Package/Case | FBGA |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Data Bus Width | 16bit |
| Density in Bits | 268435456bit |
| Package Material | Plastic |
| Address Bus Width | 15bit |
| Basic Package Type | Ball Grid Array |
| Maximum Clock Rate | 143MHz |
| Maximum Access Time | 19|6|5.4ns |
| Package Description | Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Radiation Hardening | No |
| Number of Internal Banks | 4 |
| Number of Words per Bank | 4M |
| Max Operating Temperature | 125°C |
| Maximum Operating Current | 110mA |
| Min Operating Temperature | -40°C |
| Max Operating Supply Voltage | 2.9V |
| Min Operating Supply Voltage | 2.3V |
| Typical Operating Supply Voltage | 2.5V |
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