V55C2256164VBLS8PC
Производится
Увеличить
Краткое описание:
256Mbit Mobile SDRAM 16Mx16 125MHz 60-Pin FBGA
Дополнительная информация
256Mbit Mobile SDRAM chip featuring a 16Mx16 organization and 16-bit data bus width. Operates at a maximum clock rate of 125 MHz with 4 internal banks, each containing 4M words. Housed in a 60-pin FBGA surface mount package, this component supports a typical operating voltage of 2.5V.
| PCB | 60 |
| ECCN | EAR99 |
| Type | Mobile SDRAM |
| Density | 256Mbit |
| EU RoHS | No |
| HTS Code | 8542320024 |
| Mounting | Surface Mount |
| Pin Count | 60 |
| Lead Shape | Ball |
| Schedule B | 8542320015 |
| Organization | 16Mx16 |
| Package/Case | FBGA |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Data Bus Width | 16bit |
| Density in Bits | 268435456bit |
| Package Material | Plastic |
| Address Bus Width | 15bit |
| Basic Package Type | Ball Grid Array |
| Maximum Clock Rate | 125MHz |
| Maximum Access Time | 19|6|6ns |
| Package Description | Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Radiation Hardening | No |
| Number of Internal Banks | 4 |
| Number of Words per Bank | 4M |
| Max Operating Temperature | 70°C |
| Maximum Operating Current | 90mA |
| Min Operating Temperature | 0°C |
| Max Operating Supply Voltage | 2.9V |
| Min Operating Supply Voltage | 2.3V |
| Typical Operating Supply Voltage | 2.5V |
