V55C2256164VBUB10EPC
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Краткое описание:
256M 16Mx16 Mobile SDRAM BGA Package
Дополнительная информация
This 256Mbit Mobile SDRAM features a 16Mx16 organization and supports a maximum clock rate of 100. It has a maximum operating current of 70mA and operates within a temperature range of -40°C to 125°C. The device is a surface mount BGA package made of plastic with a ball lead shape.
| ECCN | EAR99 |
| Type | Mobile SDRAM |
| Density | 256Mbit |
| EU RoHS | No |
| HTS Code | 8542320024 |
| Mounting | Surface Mount |
| Lead Shape | Ball |
| Schedule B | 8542320015 |
| Organization | 16Mx16 |
| Package/Case | BGA |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Data Bus Width | 16bit |
| Density in Bits | 268435456bit |
| Package Material | Plastic |
| Address Bus Width | 15bit |
| Basic Package Type | Ball Grid Array |
| Maximum Clock Rate | 100MHz |
| Maximum Access Time | 22|8|7ns |
| Package Description | Plastic Ball Grid Array |
| Package Family Name | BGA |
| Radiation Hardening | No |
| Number of Internal Banks | 4 |
| Number of Words per Bank | 4M |
| Max Operating Temperature | 125°C |
| Maximum Operating Current | 70mA |
| Min Operating Temperature | -40°C |
| Max Operating Supply Voltage | 2.9V |
| Min Operating Supply Voltage | 2.3V |
| Typical Operating Supply Voltage | 2.5V |
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