V55C2256164VBUB8PC
Производится
Увеличить
Краткое описание:
256M 16Mx16 Mobile SDRAM BGA Package
Дополнительная информация
This 256Mbit Mobile SDRAM features a 16Mx16 organization, 16-bit data bus width, and a maximum clock rate of 125MHz. It operates within a temperature range of 0°C to 70°C and consumes a maximum current of 90mA. The device is supplied with a typical voltage of 2.5V and a maximum voltage of 2.9V, with a minimum operating voltage of 2.3V. The BGA package is suitable for surface mount applications.
| ECCN | EAR99 |
| Type | Mobile SDRAM |
| Density | 256Mbit |
| EU RoHS | No |
| HTS Code | 8542320024 |
| Mounting | Surface Mount |
| Lead Shape | Ball |
| Schedule B | 8542320015 |
| Organization | 16Mx16 |
| Package/Case | BGA |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Data Bus Width | 16bit |
| Density in Bits | 268435456bit |
| Package Material | Plastic |
| Address Bus Width | 15bit |
| Basic Package Type | Ball Grid Array |
| Maximum Clock Rate | 125MHz |
| Maximum Access Time | 19|6|6ns |
| Package Description | Plastic Ball Grid Array |
| Package Family Name | BGA |
| Radiation Hardening | No |
| Number of Internal Banks | 4 |
| Number of Words per Bank | 4M |
| Max Operating Temperature | 70°C |
| Maximum Operating Current | 90mA |
| Min Operating Temperature | 0°C |
| Max Operating Supply Voltage | 2.9V |
| Min Operating Supply Voltage | 2.3V |
| Typical Operating Supply Voltage | 2.5V |
